Advanced FC-BGA Packaging at Gujarat Plant Powers India's AI Hardware Ambitions
CG Semi’s new OSAT facility will produce advanced flip-chip packages — FC-BGA and FC-CSP — critical for AI accelerators, 5G, and high-performance computing. The $910 million plant, backed by Renesas and Stars Microelectronics, positions India at the backend of the AI chip supply chain. With 15 million chips/day capacity, it supports the global rollout of AI infrastructure while building local technical expertise.
Source: Cg Semi (in) · Latestly